Weak current College】 【chip packaging technology know】.

<br> <br> We often hear that so-and-so chip adopts what package in our computers, there are a variety of different processing chip, so that is what is used? packaging forms and these package what technical features and advantages of .? then please see the following article will introduce you to a form in the chip package features and advantages. <br> <br> A DIP, SDIP DIP (DualIn-line Package) refers to the use of the dual form, package of integrated .circuit chip, the vast majority of small and medium scale integrated circuit (IC) are using this package, the pin count is less than 100. Use DIP package CPU chip has two rows of pins that need to be inserted into the chip structure with DIP .socket. Of course, can also be directly inserted in the hole with the same welding and geometrical arrangement of the circuit board welding. DIP package chip from chip socket-plug should be particularly careful to avoid damage to the pins. DIP package has the following .characteristics: <br> 1. fit the PCB (printed circuit board) on perforation welding, easy to operate. <br> 2. the chip area and packaging area ratio larger, so the volume are large. <br> Intel 8088 series CPU .on the adoption of this package, cache (Cache) and early memory chip is also a form of this package. Second, flat plastic side-type QFP package and PFP plastic flat component package <br> <br> QFP (Plastic Quad Flat Package .) package, the distance between the chip and PIN, the PIN is very small, very large or very large integrated circuits in general are using this package, the pin count General in more than 100. Use this form package chips must be in the SMD .(surface mounted device) will be chip and motherboard welding. Using SMD chips do not have to be installed in a hole on the motherboard, usually in the motherboard on the surface, has designed the corresponding pins of the solder joint. The foot alignment will .chip corresponding spot, can be realized and welding of the motherboard. In this way soldered chips, if no special tool is very difficult to remove. PFP (Plastic Flat Package) package chips and QFP is basically the same way. The only difference is usually .square, QFP and PFP can be either square or a rectangle. QFP / PFP package has the following characteristics: <br> 1. apply to SMD surface mount technology in PCB circuit board wiring installation. <br> 2. suitable for high frequency use .. <br> 3. easy operation and high reliability. <br> 4. the chip area and packaging area ratio smaller. <br> Intel series CPU 80286, 80386 and some 486 motherboard using this package. Third, the PGA pin grid array .package <br> <br> PGA (Pin Grid Array Package) chip packaging forms inside and outside of the chip has more than one square-shaped pin, each square-shaped pins space along the chip around a certain distance. According to the number .of pins, you can round in 2-5 times. Installation, the chip into a specialized PGA socket. For the CPU to be able to make it easier to install and remove, start from the 486 chip, called the ZIF socket of the CPU .that is specifically designed to meet the PGA package CPU in the installation and removal requirements. ZIF (Zero Insertion Force Socket) refers to the zero insertion force socket. On this socket wrench lift, the CPU can easily, easily into the socket. Then replace .the wrench pressure, using the socket itself the special structure of the generated extrusion, CPU pin and socket firmly in contact with, the absolute poor contact does not exist. Removing CPU chip simply socket spanner gently lift, pressure relief, you can easily remove the .CPU chip. The PGA package has the following characteristics: <br> 1. plug the operation more convenient, and high reliability. <br> 2. to meet the higher frequencies. <br> Intel series CPU, 80486 and Pentium Pro, Pentium .are made of this package. IV. BGA ball grid array package <br> <br> With the development of integrated circuit technology, the integrated circuit package requirements more stringent. This is because the packaging technology related to the product's functionality, when the frequency .exceeding 100MHz IC, traditional package may generate so-called "CrossTalk" phenomenon, and when the IC PIN number greater than 208 Pin, traditional package has its difficulties. Therefore, in addition to using the QFP package, nowadays most of the high number of .chip feet (such as graphics and chipset, etc.) are turning to BGA (Ball Grid Array Package) package technology. BGA appearance will become CPU, motherboard South / North Bridge chip, high density, high-performance, multiple-pin package. .BGA packaging technology and are divided into five broad categories: <br> 1.PBGA (Plasric BGA) substrate: typically 2-4 layers of organic materials constitute a multilayer Board. Intel Pentium CPU, series II, III, IV processor uses this package .. <br> 2.CBGA (CeramicBGA) substrate: the ceramic substrate, chip and substrate of the electrical connections are usually flip chip (FlipChip, hereinafter referred to as FC) installation. Intel Pentium CPU, series I, II, Pentium Pro processors .are made of this package. <br> 3.FCBGA (FilpChipBGA) substrate: rigid multilayer substrate. <br> 4.TBGA (TapeBGA) substrate: the substrate for the band soft1-2-layer PCB printed circuit boards. <br> .5.CDPBGA (Carity Down PBGA) substrate: refers to the package in the Central well low chip area (also called cavity zone). BGA package has the following characteristics: <br> 1.I / O pin count while increasing, but the .distance from the Grand pin QFP package that improves the yield. <br> 2. Although the increase in power consumption of BGA, but due to the use of a controlled collapse chip welding, which can improve the thermal performance. <br> 3. .signal transmission delay small, adapts to the frequency increased substantially. <br> 4. assemble available coplanar welding, reliability has been greatly increased. BGA package after ten years of development has entered the practical stage. In 1987, Japan citizen (Citizen), .the company started manufacturing plastic ball grid array package chip surface (ie BGA). Then, Motorola, Compaq and other companies have subsequently joined the ranks of the developed BGA. In 1993, Motorola has taken the lead in the BGA applied to mobile phones. .The same year, Compaq Corporation also workstations, PC computer. Until five or six years ago, Intel Corporation in the computer CPU (Pentium II, Pentium III, Pentium IV, etc.), as well as chipset (eg i850) began to use .BGA, to BGA applications extended play the role of the flames. At present, the BGA has become extremely popular for IC packaging technology, its global market size in 2000 for 12 million pieces, it is expected that in 2005 the market demand is higher than .in 2000, 70 per cent of the rate of growth. Fifth, chip scale packaging CSP <br> <br> As the global electronic products the personalized, light of the requirements become fashion, packaging technology has progressed to the CSP (Chip Size Package .). It reduces the overall size of the chip package, achieve bare chip size, package size as big. The package size of IC chip length is not greater than 1.2, IC area only grain (Die) large 1.4 times. CSP package can be .divided into four categories: <br> 1.Lead Frame Type (traditional wire frame form), on behalf of the manufacturer with Fujitsu, Hitachi, Rohm, Goldstar (Goldstar) and so on. <br> 2.Rigid Interposer Type (hard .interposerboard type), on behalf of the manufacturers are Motorola, Sony, Toshiba, Panasonic, etc. <br> 3.Flexible Interposer Type (soft inner panel type), one of the most famous is the Tessera company microBGA, CTS of sim- .BGA apply the same principle. The other representatives of companies including General Electric (GE) and NEC. <br> 4.Wafer Level Package (wafer size package): Unlike traditional single chip, WLCSP package is the whole wafer cutting for all single- .chip, it claims to be the future of packaging technology, has invested in research and development of manufacturers including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electric, etc. CSP package has the following characteristics: <br> 1. to meet .the increasing chip I / O PIN. <br> 2. the chip area and packaging area ratio is very small. <br> 3. greatly shorten the delay time. CSP package applies to a number of little feet, such as the memory stick .IC and portable electronic products. The future will be a large number of applications in information appliance (IA), digital television (DTV), e-books (E-Book), wireless network WLAN / ADSL / GigabitEthemet, cell phone chip, Bluetooth .(Bluetooth) and other emerging products. 6. MCM multi chip module <br> <br> To resolve a single chip with integrated low and feature deficient, the more highly integrated, high performance, high reliability of chips, in high density multilayer substrate .used Internet technology consists of a wide range of SMD electronics module system, hence MCM (Multi Chip Model) multi-chip module system. MCM has the following characteristics: <br> 1. package delay time out, easy to realize high speed modules. .<br> 2. shrinking machine / module package size and weight. <br> 3. the system's reliability has been greatly increased. Closing Word, because the CPU and other very large integrated circuit in the continual development of IC package are continuously adjusted, .and package the progress and will in turn forward the promotion microchip technology..